---
product_id: 808330745
title: "Thermal Conductive Silicone Sealant | 100 ml | Heat Transfer Adhesive for Electronics, SMD Chips & Heat Sink Bonding | White"
brand: "first seal"
price: "43.70 DT"
currency: TND
in_stock: true
category: "First Seal"
url: https://www.desertcart.tn/products/808330745-thermal-conductive-silicone-sealant-100-ml-heat-transfer-adhesive-electronics
store_origin: TN
region: Tunisia
---

# 2.5 MPa tensile strength Thermal conductivity optimized 100 ml tube for multiple uses Thermal Conductive Silicone Sealant | 100 ml | Heat Transfer Adhesive for Electronics, SMD Chips & Heat Sink Bonding | White

**Brand:** first seal
**Price:** 43.70 DT
**Availability:** ✅ In Stock

## Summary

> 🔥 Seal the heat, not your workflow!

## Quick Answers

- **What is this?** Thermal Conductive Silicone Sealant | 100 ml | Heat Transfer Adhesive for Electronics, SMD Chips & Heat Sink Bonding | White by first seal
- **How much does it cost?** 43.70 DT with free shipping
- **Is it available?** Yes, in stock and ready to ship
- **Where can I buy it?** [www.desertcart.tn](https://www.desertcart.tn/products/808330745-thermal-conductive-silicone-sealant-100-ml-heat-transfer-adhesive-electronics)

## Best For

- first seal enthusiasts

## Why This Product

- Trusted first seal brand quality
- Free international shipping included
- Worldwide delivery with tracking
- 15-day hassle-free returns

## Key Features

- • **Compact Yet Generous:** 100 ml tube offers ample sealant for multiple projects without cluttering your workspace.
- • **Secure, Screwless Bonding:** Strong adhesion eliminates the need for mechanical fasteners—clean, sleek, and reliable.
- • **Effortless Heat Management:** Silicone-based formula ensures rapid heat transfer, protecting your electronics from overheating.
- • **Precision Application, Zero Fuss:** Easy-to-use paste consistency allows exact placement—no extra tools or complicated steps needed.
- • **Versatile Electronic Compatibility:** Perfect for SMD chips, heat sinks, and diverse electronic components requiring thermal control.

## Overview

The First Seal Thermal Conductive Silicone Sealant is a high-performance, white silicone paste designed for efficient heat dissipation and strong adhesion in electronic assemblies. With a tensile strength of 2.5 MPa and a medium viscosity of 50,000 cP, this 100 ml tube provides a waterproof, screwless bonding solution ideal for SMD chips and heat sinks, curing fully in 24 hours to ensure durable, reliable thermal management.

## Description

FIRST SEAL thermal conductive silicone sealant is a versatile bonding solution designed for electronic applications requiring efficient heat dissipation. This 100ML pack of high-performance sealant features excellent adhesion properties that eliminate the need for screws or additional mechanical fastening methods, making installation quick and hassle-free. The thermal conductive formula effectively transfers heat away from sensitive components, helping to maintain optimal operating temperatures. Particularly suitable for SMD chips and other surface-mount devices, this silicone sealant creates a reliable bond whilst facilitating heat management in your electronic assemblies. The convenient 100ML quantity provides ample product for multiple applications, whether you're working on circuit boards, LED assemblies, or other electronic components that generate heat during operation. Its good adhesion characteristics ensure a secure, long-lasting bond across various substrates commonly used in electronics manufacturing and repair work.

## Features

- THERMAL CONDUCTIVE FORMULA: Silicone-based sealant designed specifically for efficient heat transfer in electronic applications, ideal for bonding SMD chips and other heat-generating components
- STRONG ADHESION: Features excellent bonding properties that eliminate the need for screws or additional mechanical fasteners, creating a secure and permanent hold on various surfaces
- VERSATILE APPLICATION: Specially formulated for surface-mount device (SMD) chips and other electronic components requiring thermal management and secure adhesion
- CONVENIENT SIZE: Comes in a 100ML tube providing ample sealant for multiple applications whilst maintaining easy storage and handling
- EASY TO USE: Simple application process allows for precise placement without complicated installation procedures or additional tools required

## Technical Specifications

| Specification | Value |
|---------------|-------|
| ASIN | B0GDMCRMX6 |
| Brand | First Seal |
| Colour | White |
| Country of Origin | India |
| Date First Available | 1 January 2026 |
| Full Cure Time | 24 Hours |
| Generic Name | Thermal Conductive Silicone Sealant |
| Included Components | 1 Tube Of Thermal Conductive Silicone Sealant |
| Item Dimensions LxWxH | 25.4 x 4 x 2.3 Centimeters |
| Item Form | Paste |
| Item Height | 2.3 Centimeters |
| Item Package Quantity | 1 |
| Item Volume | 100 Millilitres |
| Item Weight | 120 g |
| Item Width | 4 Centimeters |
| Item part number | First Seal-tcs-100ml |
| Manufacturer | First Seal |
| Material | Silicone |
| Net Quantity | 1 Count |
| Number of Memory Sticks | 1 |
| Number of Pieces | 1 |
| Package Information | Tube |
| Packer | For Packer And Manufacturer Details, Please Refer To Product Packaging Or Contact The Brand First Seal Through Authorised Retailers. |
| Product Dimensions | 25.4 x 4 x 2.3 cm; 120 g |
| Special Feature | Thermal Conductive |
| Specific Uses For Product | Electronics Assembly |
| Tensile Strength | 2.5 Megapascals |
| Viscosity | 50000 Centipoise |
| Viscosity Level | Medium |
| Water Resistance Level | Waterproof |

## Product Details

- **Brand:** First Seal
- **Item Form:** Paste
- **Material:** Silicone
- **Special Feature:** Thermal Conductive
- **Specific Uses For Product:** Electronics Assembly

## Images

![Thermal Conductive Silicone Sealant | 100 ml | Heat Transfer Adhesive for Electronics, SMD Chips & Heat Sink Bonding | White - Image 1](https://m.media-amazon.com/images/I/61dG4eYUnML.jpg)

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*Product available on Desertcart Tunisia*
*Store origin: TN*
*Last updated: 2026-06-02*