









Desertcart purchases this item on your behalf and handles shipping, customs, and support to Tunisia.
🖥️ Fix the bend, not the trend – perfect your Intel build with zero compromise!
The Thermalright LGA1700 Anti-Bending Buckle is a precision-engineered aluminum alloy backplate designed specifically for Intel 12th and 13th generation CPUs. Featuring a curved pressure plate to correct CPU stress bending, original LOTES insulation foot pads for protection, and a simple one-step installation with an included L-shaped screwdriver, it ensures a flawless, durable, and trace-free fit that enhances your desktop’s reliability and longevity.





| ASIN | B0B5Q34SZ1 |
| Best Sellers Rank | #1,619 in Computer Internal Components |
| Brand Name | Thermalright |
| Compatible Devices | Desktop |
| Cooling Method | Air |
| Customer Reviews | 4.8 4.8 out of 5 stars (1,190) |
| Included Components | 1 |
| Item Dimensions L x W x H | 2.13"L x 0.24"W x 2.76"H |
| Item Weight | 100 g |
| Manufacturer | Thermalright |
| Material Type | Metal |
| Model | LGA 17XX-BCF-BLACK-D1-G3 |
| Number of Items | 1 |
| Number of Packs | 1 |
| Part Number | LGA 17XX-BCF-BLACK-d1-G2 |
| Power Connector Type | 4-Pin |
| UPC | 796520302679 796520302563 |
| Unit Count | 1 Count |
Trustpilot
2 weeks ago
1 month ago