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The Adjustable BGA Reballing Station Kit HT-90 features a robust aluminum alloy frame that is both lightweight and corrosion-resistant. It supports a versatile 9-43mm chip size range, making it ideal for laptop CPU and mobile phone BGA reballing. Its innovative drainage channel ensures precise removal of excess solder balls, while its wear-resistant design guarantees durability for professional manual soldering tasks.






| ASIN | B08GQ4XLQ3 |
| Best Sellers Rank | #86,967 in Industrial & Scientific ( See Top 100 in Industrial & Scientific ) #206 in Soldering Stations |
| Customer Reviews | 4.4 4.4 out of 5 stars (43) |
| Date First Available | August 26, 2020 |
| Finish | Finish |
| Included Components | inc |
| Installation Method | InstallationMethod |
| Item Package Quantity | 1 |
| Item Weight | 1.76 ounces |
| Manufacturer | Walfront |
| Material | Aluminum alloy |
| Part Number | Walfronthfrbemdv2w |
| Power Source | PowerSource |
| Spout Height | 1 centimeters |
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